Structure with tapered landing and method of fabrication

Structure with tapered landing and method of fabrication

A multilayered structure is now provided which, in one form of the invention, includes a substrate, a member formed over the substrate and a connecting element. The member includes a body region and a tapered landing having a thick portion adjacent the body region, a thin portion extended from the t...

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Hauptverfasser: HARRIS, EDWARD BELDEN, MERCHANT, SAILESH MANSINH, DOWNEY, STEPHEN WARD
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HARRIS, EDWARD BELDEN
MERCHANT, SAILESH MANSINH
DOWNEY, STEPHEN WARD
description A multilayered structure is now provided which, in one form of the invention, includes a substrate, a member formed over the substrate and a connecting element. The member includes a body region and a tapered landing having a thick portion adjacent the body region, a thin portion extended from the thick portion and a surface over the thick portion and the thin portion. The connecting element is in physical contact with the tapered landing surface and extends away from the tapered landing. In an alternate form of the invention, a member formed on a substrate includes a body region and a tapered landing having a thick portion adjacent the body region, a thin portion extended from the thick portion and a surface over the thick portion and the thin portion. The surface has a slope rising from the substrate to the body region at an average angle less than 60 degrees. In an associated method an exemplary structure is formed by depositing a first layer of material over a first surface, patterning the layer to define a feature and etching the layer to define a first region of the feature having a first thickness and a second region adjoining the first region, with the second region extending away from the first region with decreasing thickness until the second region terminates. In one embodiment additional layers may be formed over the first layer to form a capacitor structure.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Structure with tapered landing and method of fabrication
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