High density, high frequency linear and area array electrical connectors

Low cost electrical connector receptacles are fabricated by utilizing highly parallel processes of PCB manufacturing. Connections are made between daughter cards and mother boards and between a chip carrier and an interposer by using receptacle hole or PTH structures in the mother boards itself or in the interposer. Such receptacles can form low profile stacks at a fine pitch, and they can readily be shielded to reduce noise introduced by high frequency components mounted on the daughter cards and the chip carrier. The novel receptacles allow also easy inclusion of discretes as decoupling capacitors. Fingers or flanges protrude from the center-holed contact pad and serve as the bending protrusions of spring-like contact elements. The flanges, in the plane of the PCB, accommodate the small PCB hole to enable connector tolerance and durability, with bending and/or torsion of flanges. The metal layer of the flanges can be either built up by well-known additive and subtractive PCB fabrication techniques, or formed or stamped separately, then laminated. The connectors can be fabricated in sparsely or fully populated linear or area arrays.