Laminated ceramic electronic component

The present invention provides a reliable ceramic electronic component in which cracks are hardly generated in the ceramic sintered body when a heat impact is applied or even when a stress caused by bending of a printed circuit board after packaging is applied, wherein inner electrodes are disposed in the ceramic sintered body, and wherein a first and second outer electrodes are formed so as to cover the first and second end faces, the first and second outer electrodes comprising electrode cover members extending to the upper face and lower face, up to both side faces of the ceramic sintered body, and the distance e and the distance Lg satisfying the relation of 1.5 x Lg ≤ e ≤ 3.5 x Lg, where e denotes a distance between the outermost side edge of the outer electrode and the inner side edge of the electrode cover member of the outer electrode, and Lg denotes the distance between the outermost side edge of the outer electrode and the tip of the inner electrode electrically connected to the outer electrode.