Semiconductor device

This invention relates to a resin encapsulated semiconductor device with lead frame. The purpose of the present invention is to provide: a resin encapsulated semiconductor package, which uses leads (lead frame), enhances heat conducting properties and prevents breaking of bonding wire, reduction in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIURA, HIDEO, HISANO, NAE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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