Wafer fabrication data acquisition and management systems

The present invention provides a semiconductor processing device (800) including a tool (802) having one or more sensors, a primary data communication port (804) and a secondary data communication port (806). A sensor data acquisition subsystem (808) acquires sensor data from the tool via the second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOUNEVA, INNA+, CORDOVA, SHERRY, DOYLE, TERRY L, LOBOVSKI, EVGUENI, KROUPNOVA, NATALIA
Format: Patent
Sprache:eng
Schlagworte:
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