Ground ring for metal electronic package

The component for an electronic package (10) has a metallic substrate (12) with a surface (16) coated by a dielectric (32). A centrally disposed cavity (22) extends through the dielectric (32) into the metallic substrate (12) to a depth, D1. Circumscribing and abutting this cavity (22) is an annular...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIEBHARD, MARKUS K, HOFFMAN, PAUL R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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