Method for cleaning an abrasive surface
A method of cleaning an abrasive surface, such as a polishing pad in a chemical-mechanical-polishing apparatus, includes the application of an acidic cleaning solution to the abrasive surface, while applying an abrasive force to the abrasive surface for the removal of reaction by-products and proces...
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| creator | WITHERS, BRADLEY SURANA, RAHUL JEW, STEPHEN BAJAJ, RAJEEV KRUSELL, WILBUR C |
| description | A method of cleaning an abrasive surface, such as a polishing pad in a chemical-mechanical-polishing apparatus, includes the application of an acidic cleaning solution to the abrasive surface, while applying an abrasive force to the abrasive surface for the removal of reaction by-products and processing debris from the abrasive surface. The acidic cleaning solution chemically reacts with the reaction by-products, and in conjunction with the abrasive force, removes the reaction by-products from the abrasive surface. In a preferred embodiment, a polishing pad used to remove copper from a semiconductor substrate is cleaned by applying a dilute hydrochloric acid solution to the polishing pad, while rotating a cleaning disk against the polishing pad. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW431940BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW431940BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW431940BB3</originalsourceid><addsrcrecordid>eNrjZFD3TS3JyE9RSMsvUkjOSU3My8xLV0jMU0hMKkoszixLVSguLUpLTE7lYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQVAJXmpJfEh4SbGhpYmBk5OxoRVAADsSicc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for cleaning an abrasive surface</title><source>esp@cenet</source><creator>WITHERS, BRADLEY ; SURANA, RAHUL ; JEW, STEPHEN ; BAJAJ, RAJEEV ; KRUSELL, WILBUR C</creator><creatorcontrib>WITHERS, BRADLEY ; SURANA, RAHUL ; JEW, STEPHEN ; BAJAJ, RAJEEV ; KRUSELL, WILBUR C</creatorcontrib><description>A method of cleaning an abrasive surface, such as a polishing pad in a chemical-mechanical-polishing apparatus, includes the application of an acidic cleaning solution to the abrasive surface, while applying an abrasive force to the abrasive surface for the removal of reaction by-products and processing debris from the abrasive surface. The acidic cleaning solution chemically reacts with the reaction by-products, and in conjunction with the abrasive force, removes the reaction by-products from the abrasive surface. In a preferred embodiment, a polishing pad used to remove copper from a semiconductor substrate is cleaned by applying a dilute hydrochloric acid solution to the polishing pad, while rotating a cleaning disk against the polishing pad.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010501&DB=EPODOC&CC=TW&NR=431940B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010501&DB=EPODOC&CC=TW&NR=431940B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WITHERS, BRADLEY</creatorcontrib><creatorcontrib>SURANA, RAHUL</creatorcontrib><creatorcontrib>JEW, STEPHEN</creatorcontrib><creatorcontrib>BAJAJ, RAJEEV</creatorcontrib><creatorcontrib>KRUSELL, WILBUR C</creatorcontrib><title>Method for cleaning an abrasive surface</title><description>A method of cleaning an abrasive surface, such as a polishing pad in a chemical-mechanical-polishing apparatus, includes the application of an acidic cleaning solution to the abrasive surface, while applying an abrasive force to the abrasive surface for the removal of reaction by-products and processing debris from the abrasive surface. The acidic cleaning solution chemically reacts with the reaction by-products, and in conjunction with the abrasive force, removes the reaction by-products from the abrasive surface. In a preferred embodiment, a polishing pad used to remove copper from a semiconductor substrate is cleaned by applying a dilute hydrochloric acid solution to the polishing pad, while rotating a cleaning disk against the polishing pad.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3TS3JyE9RSMsvUkjOSU3My8xLV0jMU0hMKkoszixLVSguLUpLTE7lYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQVAJXmpJfEh4SbGhpYmBk5OxoRVAADsSicc</recordid><startdate>20010501</startdate><enddate>20010501</enddate><creator>WITHERS, BRADLEY</creator><creator>SURANA, RAHUL</creator><creator>JEW, STEPHEN</creator><creator>BAJAJ, RAJEEV</creator><creator>KRUSELL, WILBUR C</creator><scope>EVB</scope></search><sort><creationdate>20010501</creationdate><title>Method for cleaning an abrasive surface</title><author>WITHERS, BRADLEY ; SURANA, RAHUL ; JEW, STEPHEN ; BAJAJ, RAJEEV ; KRUSELL, WILBUR C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW431940BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WITHERS, BRADLEY</creatorcontrib><creatorcontrib>SURANA, RAHUL</creatorcontrib><creatorcontrib>JEW, STEPHEN</creatorcontrib><creatorcontrib>BAJAJ, RAJEEV</creatorcontrib><creatorcontrib>KRUSELL, WILBUR C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WITHERS, BRADLEY</au><au>SURANA, RAHUL</au><au>JEW, STEPHEN</au><au>BAJAJ, RAJEEV</au><au>KRUSELL, WILBUR C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for cleaning an abrasive surface</title><date>2001-05-01</date><risdate>2001</risdate><abstract>A method of cleaning an abrasive surface, such as a polishing pad in a chemical-mechanical-polishing apparatus, includes the application of an acidic cleaning solution to the abrasive surface, while applying an abrasive force to the abrasive surface for the removal of reaction by-products and processing debris from the abrasive surface. The acidic cleaning solution chemically reacts with the reaction by-products, and in conjunction with the abrasive force, removes the reaction by-products from the abrasive surface. In a preferred embodiment, a polishing pad used to remove copper from a semiconductor substrate is cleaned by applying a dilute hydrochloric acid solution to the polishing pad, while rotating a cleaning disk against the polishing pad.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Method for cleaning an abrasive surface |
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