A method of reducing loading variation during etch processing

In preparation for etch processing a semiconductor chip having areas of little or no pattern and areas that are heavily patterned, adding non-operative patterns to the areas having little or no pattern so that the overall pattern density is about the same across the chip.

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Hauptverfasser: KLUWE, ANDREAS, ZELL, THOMAS, LIEBMANN, LARS, PREIN, FRANK
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creator KLUWE, ANDREAS
ZELL, THOMAS
LIEBMANN, LARS
PREIN, FRANK
description In preparation for etch processing a semiconductor chip having areas of little or no pattern and areas that are heavily patterned, adding non-operative patterns to the areas having little or no pattern so that the overall pattern density is about the same across the chip.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A method of reducing loading variation during etch processing
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