Solder ball loading mechanism

The present ball loading mechanism includes a movable plate. Resting on top of the plate is a ball container adapted for holding relatively large quantities of solder balls. Pressurized air is provided from two sides of the container via an air supply tube in an alternating fashion where only one of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN, CHIN HIANG, SEE TOH, WENG SANG
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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