Method for filling holes in printed wiring boards

A method for filling a hole in a printed wiring board (PWB) and the resultant PWB. During an intermediate stage in fabrication, a PWB comprises a lamination of dielectric sheets with metalizations on various layers and a plated through hole (PTH). A photoimageable material is formed on a surface of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FARQUHAR, DONALD SETON, BOYKO, CHRISTINA MARIE, FUERNISS, STEPHEN JOSEPH, APPELT, BERND KARL-HEINZ, KLODOWSKI, MICHAEL JOSEPH
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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