Fluid treatment apparatus and method applicable for PCB etching
A fluid treatment apparatus and method applicable for PCB etching, by applying the first and second fluids onto the article passing by one of them, having the device: a casing, for defining a chamber inside it; the first fluid injector, disposed in the casing, for injection of the first fluid onto t...
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| creator | GERALD ANDREI BENDZ MICHAEL SHAWN HORAN JOHN ROBERT CHAPURA MICHAEL JAMES CHNESTARO EDWARD JAY FRANKOSKI JEFFREY DONALD JONES STEVEN LINDZ BARD |
| description | A fluid treatment apparatus and method applicable for PCB etching, by applying the first and second fluids onto the article passing by one of them, having the device: a casing, for defining a chamber inside it; the first fluid injector, disposed in the casing, for injection of the first fluid onto the surface of the article; the first device, for collection of the primary volume of the first fluid being injected onto the article in the casing chamber, being a minor part of the fluid not collected by the first device in the chamber and the collected major volume taking the first position in the chamber; a device for circulation of the first fluid being collected in major volume to the first fluid injector; the second fluid injector, including the first and the second fluid applicant, disposed inside the casing, for injection of the second fluid roughly onto the surface of the article on the adjacent first fluid injector position; step water reservoir, including the first and the second collection chambers, for |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE NOZZLES PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | Fluid treatment apparatus and method applicable for PCB etching |
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