High resolution phase edge lithography without the need for a trim mask

A process of phase edge lithography is employed in the manufacture of very large scale integrated (VLSI) chips in which chrome images are biased on a phase edge of a phase shift mask (PSM) and the mask overexposed to compensate for the positive bias. This overexposure eliminates any residual images...

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Bibliographische Detailangaben
Hauptverfasser: RONALD MICHAEL MARTINO, THOMAS HAROLD NEWMAN, RICHARD ALAN FERGUSON, LARS WOLFGANG LIEBMANN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A process of phase edge lithography is employed in the manufacture of very large scale integrated (VLSI) chips in which chrome images are biased on a phase edge of a phase shift mask (PSM) and the mask overexposed to compensate for the positive bias. This overexposure eliminates any residual images from the phase edge mask with minimum impact to the desired images. This simple process results in a trim-less phase edge process that takes advantage of the improved resolution and process latitude of phase edge PSMs while avoiding layout impacts caused by a trim mask or other phase edge elimination methods.