Structural member
A structural member 10 includes a base material 100 and a protective film 200 covering a surface 110 of the base material 100. When, in a cross-section of the protective film 200 cut perpendicularly to the surface 110, a proportion of pores per unit area is defined as porosity, the porosity in a fir...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OTSUKA, NOBUTOMO KINJO, ATSUSHI TODA, FUMITO |
| description | A structural member 10 includes a base material 100 and a protective film 200 covering a surface 110 of the base material 100. When, in a cross-section of the protective film 200 cut perpendicularly to the surface 110, a proportion of pores per unit area is defined as porosity, the porosity in a first portion 201 that is a portion of the cross-section is lower than the porosity in a second portion 202 that is a portion of the cross-section closer to the base material 100 side thereof than the first portion 201. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202441604A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202441604A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202441604A3</originalsourceid><addsrcrecordid>eNrjZBAMLikqTS4pLUrMUchNzU1KLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRiYmhmYGJo7GxKgBAOjXH-s</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Structural member</title><source>esp@cenet</source><creator>OTSUKA, NOBUTOMO ; KINJO, ATSUSHI ; TODA, FUMITO</creator><creatorcontrib>OTSUKA, NOBUTOMO ; KINJO, ATSUSHI ; TODA, FUMITO</creatorcontrib><description>A structural member 10 includes a base material 100 and a protective film 200 covering a surface 110 of the base material 100. When, in a cross-section of the protective film 200 cut perpendicularly to the surface 110, a proportion of pores per unit area is defined as porosity, the porosity in a first portion 201 that is a portion of the cross-section is lower than the porosity in a second portion 202 that is a portion of the cross-section closer to the base material 100 side thereof than the first portion 201.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASTING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; METALLURGY ; PERFORMING OPERATIONS ; POWDER METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241016&DB=EPODOC&CC=TW&NR=202441604A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241016&DB=EPODOC&CC=TW&NR=202441604A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTSUKA, NOBUTOMO</creatorcontrib><creatorcontrib>KINJO, ATSUSHI</creatorcontrib><creatorcontrib>TODA, FUMITO</creatorcontrib><title>Structural member</title><description>A structural member 10 includes a base material 100 and a protective film 200 covering a surface 110 of the base material 100. When, in a cross-section of the protective film 200 cut perpendicularly to the surface 110, a proportion of pores per unit area is defined as porosity, the porosity in a first portion 201 that is a portion of the cross-section is lower than the porosity in a second portion 202 that is a portion of the cross-section closer to the base material 100 side thereof than the first portion 201.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASTING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMLikqTS4pLUrMUchNzU1KLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRiYmhmYGJo7GxKgBAOjXH-s</recordid><startdate>20241016</startdate><enddate>20241016</enddate><creator>OTSUKA, NOBUTOMO</creator><creator>KINJO, ATSUSHI</creator><creator>TODA, FUMITO</creator><scope>EVB</scope></search><sort><creationdate>20241016</creationdate><title>Structural member</title><author>OTSUKA, NOBUTOMO ; KINJO, ATSUSHI ; TODA, FUMITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202441604A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASTING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>OTSUKA, NOBUTOMO</creatorcontrib><creatorcontrib>KINJO, ATSUSHI</creatorcontrib><creatorcontrib>TODA, FUMITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTSUKA, NOBUTOMO</au><au>KINJO, ATSUSHI</au><au>TODA, FUMITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Structural member</title><date>2024-10-16</date><risdate>2024</risdate><abstract>A structural member 10 includes a base material 100 and a protective film 200 covering a surface 110 of the base material 100. When, in a cross-section of the protective film 200 cut perpendicularly to the surface 110, a proportion of pores per unit area is defined as porosity, the porosity in a first portion 201 that is a portion of the cross-section is lower than the porosity in a second portion 202 that is a portion of the cross-section closer to the base material 100 side thereof than the first portion 201.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202441604A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WORKING METALLIC POWDER |
| title | Structural member |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T20%3A18%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OTSUKA,%20NOBUTOMO&rft.date=2024-10-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202441604A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |