Temperature control system, method for manufacturing semiconductor device, processing device, and program
Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperatu...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SHIGEMATSU, SEIYA NAKANISHI, KENTO YAMAGUCHI, HIDETO |
| description | Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202440995A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202440995A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202440995A3</originalsourceid><addsrcrecordid>eNqNyr0KwjAUxfEuDqK-w3WvUGodOoooPkDBsVyS0xpoPshNBN_eFnR3OvA_v3VhOtiAyClHkPIuRT-RvCXBlmSRnl7T4CNZdnlgNTPjRhJYM2OdVZo_jZdRKClEryCygF9ip5c8RrbbYjXwJNh9d1Psb9fucj8g-B4SWMEh9d2jruqmqdr2dD7-Yz7PP0Gl</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Temperature control system, method for manufacturing semiconductor device, processing device, and program</title><source>esp@cenet</source><creator>SHIGEMATSU, SEIYA ; NAKANISHI, KENTO ; YAMAGUCHI, HIDETO</creator><creatorcontrib>SHIGEMATSU, SEIYA ; NAKANISHI, KENTO ; YAMAGUCHI, HIDETO</creatorcontrib><description>Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241016&DB=EPODOC&CC=TW&NR=202440995A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241016&DB=EPODOC&CC=TW&NR=202440995A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIGEMATSU, SEIYA</creatorcontrib><creatorcontrib>NAKANISHI, KENTO</creatorcontrib><creatorcontrib>YAMAGUCHI, HIDETO</creatorcontrib><title>Temperature control system, method for manufacturing semiconductor device, processing device, and program</title><description>Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAUxfEuDqK-w3WvUGodOoooPkDBsVyS0xpoPshNBN_eFnR3OvA_v3VhOtiAyClHkPIuRT-RvCXBlmSRnl7T4CNZdnlgNTPjRhJYM2OdVZo_jZdRKClEryCygF9ip5c8RrbbYjXwJNh9d1Psb9fucj8g-B4SWMEh9d2jruqmqdr2dD7-Yz7PP0Gl</recordid><startdate>20241016</startdate><enddate>20241016</enddate><creator>SHIGEMATSU, SEIYA</creator><creator>NAKANISHI, KENTO</creator><creator>YAMAGUCHI, HIDETO</creator><scope>EVB</scope></search><sort><creationdate>20241016</creationdate><title>Temperature control system, method for manufacturing semiconductor device, processing device, and program</title><author>SHIGEMATSU, SEIYA ; NAKANISHI, KENTO ; YAMAGUCHI, HIDETO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202440995A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIGEMATSU, SEIYA</creatorcontrib><creatorcontrib>NAKANISHI, KENTO</creatorcontrib><creatorcontrib>YAMAGUCHI, HIDETO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIGEMATSU, SEIYA</au><au>NAKANISHI, KENTO</au><au>YAMAGUCHI, HIDETO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Temperature control system, method for manufacturing semiconductor device, processing device, and program</title><date>2024-10-16</date><risdate>2024</risdate><abstract>Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202440995A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Temperature control system, method for manufacturing semiconductor device, processing device, and program |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T04%3A01%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIGEMATSU,%20SEIYA&rft.date=2024-10-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202440995A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |