Pickup apparatus and method of using the same

A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between the platform and the semiconductor packa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN, CHIH-WEI, LIANG, HSIAOUNG, HUANG, YING-JUI, HSIEH, CHING-HUA, LIAO, JENUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!