Power semiconductor packaging signal connection element and semiconductor module

A power semiconductor packaging signal connection element includes a cylinder and two bases. The cylinder has a first through hole. The bases are respectively disposed on opposite sides of the cylinder. Each of the bases includes a continuous protruding pattern and has a flat surface, a curved surfa...

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Bibliographische Detailangaben

Hauptverfasser:	CHEN, TING-LING, LIU, CHING-WEN, TSAI, HSINANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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