Power semiconductor packaging signal connection element and semiconductor module
A power semiconductor packaging signal connection element includes a cylinder and two bases. The cylinder has a first through hole. The bases are respectively disposed on opposite sides of the cylinder. Each of the bases includes a continuous protruding pattern and has a flat surface, a curved surfa...
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| creator | CHEN, TING-LING LIU, CHING-WEN TSAI, HSINANG |
| description | A power semiconductor packaging signal connection element includes a cylinder and two bases. The cylinder has a first through hole. The bases are respectively disposed on opposite sides of the cylinder. Each of the bases includes a continuous protruding pattern and has a flat surface, a curved surface and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole passes through the curved surface and communicates with the first through hole. The continuous protruding pattern is connected to a second side of the curved surface and is located on the flat surface. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202433704A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202433704A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202433704A3</originalsourceid><addsrcrecordid>eNrjZAgIyC9PLVIoTs3NTM7PSylNLskvUihITM5OTM_MS1cozkzPS8xRAErlpSaXZObnKaTmpOam5pUoJOaloOnKzU8pzUnlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUCjU_NSS-JDwo0MjEyMjc0NTByNiVEDABJ5OF4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power semiconductor packaging signal connection element and semiconductor module</title><source>esp@cenet</source><creator>CHEN, TING-LING ; LIU, CHING-WEN ; TSAI, HSINANG</creator><creatorcontrib>CHEN, TING-LING ; LIU, CHING-WEN ; TSAI, HSINANG</creatorcontrib><description>A power semiconductor packaging signal connection element includes a cylinder and two bases. The cylinder has a first through hole. The bases are respectively disposed on opposite sides of the cylinder. Each of the bases includes a continuous protruding pattern and has a flat surface, a curved surface and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole passes through the curved surface and communicates with the first through hole. The continuous protruding pattern is connected to a second side of the curved surface and is located on the flat surface.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240816&DB=EPODOC&CC=TW&NR=202433704A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240816&DB=EPODOC&CC=TW&NR=202433704A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN, TING-LING</creatorcontrib><creatorcontrib>LIU, CHING-WEN</creatorcontrib><creatorcontrib>TSAI, HSINANG</creatorcontrib><title>Power semiconductor packaging signal connection element and semiconductor module</title><description>A power semiconductor packaging signal connection element includes a cylinder and two bases. The cylinder has a first through hole. The bases are respectively disposed on opposite sides of the cylinder. Each of the bases includes a continuous protruding pattern and has a flat surface, a curved surface and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole passes through the curved surface and communicates with the first through hole. The continuous protruding pattern is connected to a second side of the curved surface and is located on the flat surface.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgIyC9PLVIoTs3NTM7PSylNLskvUihITM5OTM_MS1cozkzPS8xRAErlpSaXZObnKaTmpOam5pUoJOaloOnKzU8pzUnlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUCjU_NSS-JDwo0MjEyMjc0NTByNiVEDABJ5OF4</recordid><startdate>20240816</startdate><enddate>20240816</enddate><creator>CHEN, TING-LING</creator><creator>LIU, CHING-WEN</creator><creator>TSAI, HSINANG</creator><scope>EVB</scope></search><sort><creationdate>20240816</creationdate><title>Power semiconductor packaging signal connection element and semiconductor module</title><author>CHEN, TING-LING ; LIU, CHING-WEN ; TSAI, HSINANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202433704A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN, TING-LING</creatorcontrib><creatorcontrib>LIU, CHING-WEN</creatorcontrib><creatorcontrib>TSAI, HSINANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN, TING-LING</au><au>LIU, CHING-WEN</au><au>TSAI, HSINANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power semiconductor packaging signal connection element and semiconductor module</title><date>2024-08-16</date><risdate>2024</risdate><abstract>A power semiconductor packaging signal connection element includes a cylinder and two bases. The cylinder has a first through hole. The bases are respectively disposed on opposite sides of the cylinder. Each of the bases includes a continuous protruding pattern and has a flat surface, a curved surface and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole passes through the curved surface and communicates with the first through hole. The continuous protruding pattern is connected to a second side of the curved surface and is located on the flat surface.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Power semiconductor packaging signal connection element and semiconductor module |
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