Jet impingement heatsink for high power semiconductor devices
A jet impingement cooling assembly for semiconductor devices may include a heat exchange base having an inlet chamber and an outlet chamber, an inlet connection in fluid connection with the inlet chamber, and an outlet connection in fluid connection with the outlet chamber. A plurality of jet nozzle...
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| creator | YUN, CHANG-SUN JEON, O-SEOB |
| description | A jet impingement cooling assembly for semiconductor devices may include a heat exchange base having an inlet chamber and an outlet chamber, an inlet connection in fluid connection with the inlet chamber, and an outlet connection in fluid connection with the outlet chamber. A plurality of jet nozzles may be attached to a semiconductor module, with the plurality of jet nozzles including corresponding openings positioned to cause jet impingement of fluid flow from the inlet chamber onto the semiconductor module and then into the outlet chamber. |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202433002A |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS |
| title | Jet impingement heatsink for high power semiconductor devices |
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