Composition for electronic device sealing, electronic device sealing film, and method for forming electronic device sealing film

A composition for electronic device sealing according to the present invention contains a photopolymerizable monomer and a photopolymerization initiator. With respect to this composition for electronic device sealing, a (meth)acrylate is contained as the photopolymerizable monomer; an electronic dev...

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Bibliographische Detailangaben
Hauptverfasser:	HIROSAWA, SHOTA, REN, RIEKO, MORIKAWA, SHINICHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	A composition for electronic device sealing according to the present invention contains a photopolymerizable monomer and a photopolymerization initiator. With respect to this composition for electronic device sealing, a (meth)acrylate is contained as the photopolymerizable monomer; an electronic device sealing film which is formed by curing this composition for electronic device sealing by means of irradiation of ultraviolet light having a wavelength of 395 nm at 1.5 Jcm-2 in a nitrogen environment has a refractive index within the range of from 1.45 to 1.56 at a wavelength of 380 nm; and this electronic device sealing film has an extinction coefficient within the range of from 50 * 10-5 to 200 * 10-5 at a wavelength of 380 nm.