Hole making device capable of reducing a workload of piping cleaning

Hole making device capable of reducing a workload of piping cleaning

Provided is a hole making device capable of reducing a workload of piping cleaning. The hole making device (1) comprises: a hole making portion that performs a hole making processing on a workpiece (W); a mounting table (40) having a discharge chamber (43) disposed on the opposite side of the hole m...

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Hauptverfasser: OSANAI, TAKUMI, ITO, YASUSHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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creator OSANAI, TAKUMI
ITO, YASUSHI
description Provided is a hole making device capable of reducing a workload of piping cleaning. The hole making device (1) comprises: a hole making portion that performs a hole making processing on a workpiece (W); a mounting table (40) having a discharge chamber (43) disposed on the opposite side of the hole making portion relative to a mounting surface where the workpiece (W) is placed and configured to discharge dusts generated during the hole making processing by the hole making portion; a dust collector (20) that collects dusts from the discharge chamber (43); a piping (21A) connected to the dust collector (20) to form a suction path (SP1) for sucking dusts; and a recovery unit (50) that is detachably mounted to the piping (21A) in a manner intervening in the suction path (SP1), and is constructed to allow dusts to accumulate more easily compared to the piping (21A). The hole making device further comprise a pressure sensor that detects the pressure in the discharge chamber; and a control unit that provides a notifi
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202432287A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202432287A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202432287A3</originalsourceid><addsrcrecordid>eNrjZHDxyM9JVchNzM7MS1dISS3LTE5VSE4sSEwCiuanKRSlppQmg6QSFcrzi7Jz8hNTQMIFmQUgweSc1MQ8IIOHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsSHhBsZGJkYGxlZmDsaE6MGAGXsMlk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Hole making device capable of reducing a workload of piping cleaning</title><source>esp@cenet</source><creator>OSANAI, TAKUMI ; ITO, YASUSHI</creator><creatorcontrib>OSANAI, TAKUMI ; ITO, YASUSHI</creatorcontrib><description>Provided is a hole making device capable of reducing a workload of piping cleaning. The hole making device (1) comprises: a hole making portion that performs a hole making processing on a workpiece (W); a mounting table (40) having a discharge chamber (43) disposed on the opposite side of the hole making portion relative to a mounting surface where the workpiece (W) is placed and configured to discharge dusts generated during the hole making processing by the hole making portion; a dust collector (20) that collects dusts from the discharge chamber (43); a piping (21A) connected to the dust collector (20) to form a suction path (SP1) for sucking dusts; and a recovery unit (50) that is detachably mounted to the piping (21A) in a manner intervening in the suction path (SP1), and is constructed to allow dusts to accumulate more easily compared to the piping (21A). The hole making device further comprise a pressure sensor that detects the pressure in the discharge chamber; and a control unit that provides a notifi</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240816&amp;DB=EPODOC&amp;CC=TW&amp;NR=202432287A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240816&amp;DB=EPODOC&amp;CC=TW&amp;NR=202432287A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OSANAI, TAKUMI</creatorcontrib><creatorcontrib>ITO, YASUSHI</creatorcontrib><title>Hole making device capable of reducing a workload of piping cleaning</title><description>Provided is a hole making device capable of reducing a workload of piping cleaning. The hole making device (1) comprises: a hole making portion that performs a hole making processing on a workpiece (W); a mounting table (40) having a discharge chamber (43) disposed on the opposite side of the hole making portion relative to a mounting surface where the workpiece (W) is placed and configured to discharge dusts generated during the hole making processing by the hole making portion; a dust collector (20) that collects dusts from the discharge chamber (43); a piping (21A) connected to the dust collector (20) to form a suction path (SP1) for sucking dusts; and a recovery unit (50) that is detachably mounted to the piping (21A) in a manner intervening in the suction path (SP1), and is constructed to allow dusts to accumulate more easily compared to the piping (21A). The hole making device further comprise a pressure sensor that detects the pressure in the discharge chamber; and a control unit that provides a notifi</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxyM9JVchNzM7MS1dISS3LTE5VSE4sSEwCiuanKRSlppQmg6QSFcrzi7Jz8hNTQMIFmQUgweSc1MQ8IIOHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsSHhBsZGJkYGxlZmDsaE6MGAGXsMlk</recordid><startdate>20240816</startdate><enddate>20240816</enddate><creator>OSANAI, TAKUMI</creator><creator>ITO, YASUSHI</creator><scope>EVB</scope></search><sort><creationdate>20240816</creationdate><title>Hole making device capable of reducing a workload of piping cleaning</title><author>OSANAI, TAKUMI ; ITO, YASUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202432287A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>OSANAI, TAKUMI</creatorcontrib><creatorcontrib>ITO, YASUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OSANAI, TAKUMI</au><au>ITO, YASUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Hole making device capable of reducing a workload of piping cleaning</title><date>2024-08-16</date><risdate>2024</risdate><abstract>Provided is a hole making device capable of reducing a workload of piping cleaning. The hole making device (1) comprises: a hole making portion that performs a hole making processing on a workpiece (W); a mounting table (40) having a discharge chamber (43) disposed on the opposite side of the hole making portion relative to a mounting surface where the workpiece (W) is placed and configured to discharge dusts generated during the hole making processing by the hole making portion; a dust collector (20) that collects dusts from the discharge chamber (43); a piping (21A) connected to the dust collector (20) to form a suction path (SP1) for sucking dusts; and a recovery unit (50) that is detachably mounted to the piping (21A) in a manner intervening in the suction path (SP1), and is constructed to allow dusts to accumulate more easily compared to the piping (21A). The hole making device further comprise a pressure sensor that detects the pressure in the discharge chamber; and a control unit that provides a notifi</abstract><oa>free_for_read</oa></addata></record>
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Hole making device capable of reducing a workload of piping cleaning
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T02%3A41%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OSANAI,%20TAKUMI&rft.date=2024-08-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202432287A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true