Package carrier and manufacturing method thereof and chip package structure

A package carrier includes a signal board, a power board and a connection layer. The signal board includes a plurality of first circuits. The power board includes a plurality of second circuits. A line width of each of the first circuit is smaller than a line width of each of the second circuit, and...

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1. Verfasser:	HO, CHUNG-WEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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