Package carrier and manufacturing method thereof and chip package structure

Package carrier and manufacturing method thereof and chip package structure

A package carrier includes a signal board, a power board and a connection layer. The signal board includes a plurality of first circuits. The power board includes a plurality of second circuits. A line width of each of the first circuit is smaller than a line width of each of the second circuit, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HO, CHUNG-WEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package carrier includes a signal board, a power board and a connection layer. The signal board includes a plurality of first circuits. The power board includes a plurality of second circuits. A line width of each of the first circuit is smaller than a line width of each of the second circuit, and a first thickness of the signal board is smaller than a second thickness of the power board. The connection layer is disposed between the signal board and the power board, wherein the power board is electrically connected to the signal board through the connection layer.