Circuit module and restricting mechanism thereof
A restricting mechanism for suppressing warpage of a substrate on a circuit board is provided, including a quadrilateral frame and a plurality of fasteners. The frame forms four through holes, and the fasteners respectively have a head portion and a rod portion connected to each other. The rod porti...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | TSENG, TSUNG-PIN CHEN, CHIHNG |
description | A restricting mechanism for suppressing warpage of a substrate on a circuit board is provided, including a quadrilateral frame and a plurality of fasteners. The frame forms four through holes, and the fasteners respectively have a head portion and a rod portion connected to each other. The rod portions of the fasteners extend through the through holes, and the diameter of the head portions is greater than the diameter of the through holes. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202425723A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202425723A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202425723A3</originalsourceid><addsrcrecordid>eNrjZDBwzixKLs0sUcjNTynNSVVIzEtRKEotLinKTC7JzEtXyE1NzkjMyyzOVSjJSC1KzU_jYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkYmRqbmRsaOxsSoAQCCwiu9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit module and restricting mechanism thereof</title><source>esp@cenet</source><creator>TSENG, TSUNG-PIN ; CHEN, CHIHNG</creator><creatorcontrib>TSENG, TSUNG-PIN ; CHEN, CHIHNG</creatorcontrib><description>A restricting mechanism for suppressing warpage of a substrate on a circuit board is provided, including a quadrilateral frame and a plurality of fasteners. The frame forms four through holes, and the fasteners respectively have a head portion and a rod portion connected to each other. The rod portions of the fasteners extend through the through holes, and the diameter of the head portions is greater than the diameter of the through holes.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240616&DB=EPODOC&CC=TW&NR=202425723A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240616&DB=EPODOC&CC=TW&NR=202425723A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSENG, TSUNG-PIN</creatorcontrib><creatorcontrib>CHEN, CHIHNG</creatorcontrib><title>Circuit module and restricting mechanism thereof</title><description>A restricting mechanism for suppressing warpage of a substrate on a circuit board is provided, including a quadrilateral frame and a plurality of fasteners. The frame forms four through holes, and the fasteners respectively have a head portion and a rod portion connected to each other. The rod portions of the fasteners extend through the through holes, and the diameter of the head portions is greater than the diameter of the through holes.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBwzixKLs0sUcjNTynNSVVIzEtRKEotLinKTC7JzEtXyE1NzkjMyyzOVSjJSC1KzU_jYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkYmRqbmRsaOxsSoAQCCwiu9</recordid><startdate>20240616</startdate><enddate>20240616</enddate><creator>TSENG, TSUNG-PIN</creator><creator>CHEN, CHIHNG</creator><scope>EVB</scope></search><sort><creationdate>20240616</creationdate><title>Circuit module and restricting mechanism thereof</title><author>TSENG, TSUNG-PIN ; CHEN, CHIHNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202425723A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TSENG, TSUNG-PIN</creatorcontrib><creatorcontrib>CHEN, CHIHNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSENG, TSUNG-PIN</au><au>CHEN, CHIHNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit module and restricting mechanism thereof</title><date>2024-06-16</date><risdate>2024</risdate><abstract>A restricting mechanism for suppressing warpage of a substrate on a circuit board is provided, including a quadrilateral frame and a plurality of fasteners. The frame forms four through holes, and the fasteners respectively have a head portion and a rod portion connected to each other. The rod portions of the fasteners extend through the through holes, and the diameter of the head portions is greater than the diameter of the through holes.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_TW202425723A |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Circuit module and restricting mechanism thereof |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-16T09%3A03%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSENG,%20TSUNG-PIN&rft.date=2024-06-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202425723A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |