Flow distribution apparatus for an inert anode plating cell
In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamb...
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| creator | KEARNS, GREGORY BLICKENSDERFER, JACOB KURTIS BUCKALEW, BRYAN L |
| description | In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamber is disposed within the plating cell, and a charge plate is disposed within the anode chamber. An anode is positioned above the charge plate within the anode chamber. In some examples, the anode chamber is a membrane-less anode chamber. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202424278A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202424278A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202424278A3</originalsourceid><addsrcrecordid>eNrjZLB2y8kvV0jJLC4pykwqLcnMz1NILChILEosKS1WSMsvUkjMU8jMSy0qATLyU1IVCnISSzLz0hWSU3NyeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJfEi4kYGRCRCaWzgaE6MGAMSrL6s</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Flow distribution apparatus for an inert anode plating cell</title><source>esp@cenet</source><creator>KEARNS, GREGORY ; BLICKENSDERFER, JACOB KURTIS ; BUCKALEW, BRYAN L</creator><creatorcontrib>KEARNS, GREGORY ; BLICKENSDERFER, JACOB KURTIS ; BUCKALEW, BRYAN L</creatorcontrib><description>In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamber is disposed within the plating cell, and a charge plate is disposed within the anode chamber. An anode is positioned above the charge plate within the anode chamber. In some examples, the anode chamber is a membrane-less anode chamber.</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240616&DB=EPODOC&CC=TW&NR=202424278A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240616&DB=EPODOC&CC=TW&NR=202424278A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KEARNS, GREGORY</creatorcontrib><creatorcontrib>BLICKENSDERFER, JACOB KURTIS</creatorcontrib><creatorcontrib>BUCKALEW, BRYAN L</creatorcontrib><title>Flow distribution apparatus for an inert anode plating cell</title><description>In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamber is disposed within the plating cell, and a charge plate is disposed within the anode chamber. An anode is positioned above the charge plate within the anode chamber. In some examples, the anode chamber is a membrane-less anode chamber.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB2y8kvV0jJLC4pykwqLcnMz1NILChILEosKS1WSMsvUkjMU8jMSy0qATLyU1IVCnISSzLz0hWSU3NyeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJfEi4kYGRCRCaWzgaE6MGAMSrL6s</recordid><startdate>20240616</startdate><enddate>20240616</enddate><creator>KEARNS, GREGORY</creator><creator>BLICKENSDERFER, JACOB KURTIS</creator><creator>BUCKALEW, BRYAN L</creator><scope>EVB</scope></search><sort><creationdate>20240616</creationdate><title>Flow distribution apparatus for an inert anode plating cell</title><author>KEARNS, GREGORY ; BLICKENSDERFER, JACOB KURTIS ; BUCKALEW, BRYAN L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202424278A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KEARNS, GREGORY</creatorcontrib><creatorcontrib>BLICKENSDERFER, JACOB KURTIS</creatorcontrib><creatorcontrib>BUCKALEW, BRYAN L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KEARNS, GREGORY</au><au>BLICKENSDERFER, JACOB KURTIS</au><au>BUCKALEW, BRYAN L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flow distribution apparatus for an inert anode plating cell</title><date>2024-06-16</date><risdate>2024</risdate><abstract>In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamber is disposed within the plating cell, and a charge plate is disposed within the anode chamber. An anode is positioned above the charge plate within the anode chamber. In some examples, the anode chamber is a membrane-less anode chamber.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | Flow distribution apparatus for an inert anode plating cell |
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