Wafer chuck assembly

The present disclosure generally relates to chuck technology for supporting semiconductor wafers during processing. In one example, a wafer chuck assembly comprises a chuck hub and a centering hub disposed within the chuck hub. An engagement device is operable between an engaged position and a disen...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	STOWELL, ROBERT MARSHALL, PUHA, CLAUDIU VALENTIN, LABRIE, AARON LOUIS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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