Processing liquid, method for treating object to be treated, and method for manufacturing semiconductor device wherein the processing liquid is excellent in inhibiting corrosions of Cu and also excellent in removing organic residues

The present invention provides a processing liquid that is excellent in inhibiting corrosions of Cu and also excellent in removing organic residues. The processing liquid contains a reducing agent, and at least one specific compound selected from the group consisting of dehydroascorbic acid, 2,3-dik...

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Bibliographische Detailangaben
Hauptverfasser: OUCHI, NAOKO, KAMIMURA, TETSUYA, MATSUMOTO, HANAE, MURO, NAOTSUGU
Format: Patent
Sprache:chi ; eng
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