Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows
Disclosed herein are systems, methods, and devices processing feed material utilizing an upstream swirl module and composite gas flows. Some embodiments are directed to a microwave plasma apparatus for processing a material, comprising: a first flow module, a second flow module, and a liner; a first...
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| creator | KOZLOWSKI, MICHAEL C MATYS, PAWEL RESNICK, MICHAEL |
| description | Disclosed herein are systems, methods, and devices processing feed material utilizing an upstream swirl module and composite gas flows. Some embodiments are directed to a microwave plasma apparatus for processing a material, comprising: a first flow module, a second flow module, and a liner; a first swirl module in communication the second flow module, the first swirl module comprising one or more first gas inlets, the one or more first gas inlets configured to generate a first swirl gas flow towards the second swirl module; the second swirl module comprising one or more second gas inlets, the one or more second gas inlets configured to generate a second swirl gas flow towards the liner, wherein the first swirl module and the second swirl module are configured such that the first swirl gas flow and the second swirl gas flow are combined into a composite gas flow prior to entering the liner. |
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Some embodiments are directed to a microwave plasma apparatus for processing a material, comprising: a first flow module, a second flow module, and a liner; a first swirl module in communication the second flow module, the first swirl module comprising one or more first gas inlets, the one or more first gas inlets configured to generate a first swirl gas flow towards the second swirl module; the second swirl module comprising one or more second gas inlets, the one or more second gas inlets configured to generate a second swirl gas flow towards the liner, wherein the first swirl module and the second swirl module are configured such that the first swirl gas flow and the second swirl gas flow are combined into a composite gas flow prior to entering the liner.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PLASMA TECHNIQUE ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240401&DB=EPODOC&CC=TW&NR=202413712A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240401&DB=EPODOC&CC=TW&NR=202413712A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOZLOWSKI, MICHAEL C</creatorcontrib><creatorcontrib>MATYS, PAWEL</creatorcontrib><creatorcontrib>RESNICK, MICHAEL</creatorcontrib><title>Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows</title><description>Disclosed herein are systems, methods, and devices processing feed material utilizing an upstream swirl module and composite gas flows. Some embodiments are directed to a microwave plasma apparatus for processing a material, comprising: a first flow module, a second flow module, and a liner; a first swirl module in communication the second flow module, the first swirl module comprising one or more first gas inlets, the one or more first gas inlets configured to generate a first swirl gas flow towards the second swirl module; the second swirl module comprising one or more second gas inlets, the one or more second gas inlets configured to generate a second swirl gas flow towards the liner, wherein the first swirl module and the second swirl module are configured such that the first swirl gas flow and the second swirl gas flow are combined into a composite gas flow prior to entering the liner.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PLASMA TECHNIQUE</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwkAMRbtxIeod4gEE2wquRRSXLgouS2jTOjAzCZMMBU9vFQ_g6sF_n7cs7O5RAwKKYELLChh7CGRP7hUGTiCJO1J1cYSBaHZolBx6yOa8e312jJBFLREG0MklD4H77Onb6jgIqzOCEeei50nXxWJAr7T5cVVsr5fmfNuRcEsq2FEka5tHta8OZX0sq1P9z-cN1tRFeg</recordid><startdate>20240401</startdate><enddate>20240401</enddate><creator>KOZLOWSKI, MICHAEL C</creator><creator>MATYS, PAWEL</creator><creator>RESNICK, MICHAEL</creator><scope>EVB</scope></search><sort><creationdate>20240401</creationdate><title>Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows</title><author>KOZLOWSKI, MICHAEL C ; MATYS, PAWEL ; RESNICK, MICHAEL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202413712A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PLASMA TECHNIQUE</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KOZLOWSKI, MICHAEL C</creatorcontrib><creatorcontrib>MATYS, PAWEL</creatorcontrib><creatorcontrib>RESNICK, MICHAEL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOZLOWSKI, MICHAEL C</au><au>MATYS, PAWEL</au><au>RESNICK, MICHAEL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows</title><date>2024-04-01</date><risdate>2024</risdate><abstract>Disclosed herein are systems, methods, and devices processing feed material utilizing an upstream swirl module and composite gas flows. Some embodiments are directed to a microwave plasma apparatus for processing a material, comprising: a first flow module, a second flow module, and a liner; a first swirl module in communication the second flow module, the first swirl module comprising one or more first gas inlets, the one or more first gas inlets configured to generate a first swirl gas flow towards the second swirl module; the second swirl module comprising one or more second gas inlets, the one or more second gas inlets configured to generate a second swirl gas flow towards the liner, wherein the first swirl module and the second swirl module are configured such that the first swirl gas flow and the second swirl gas flow are combined into a composite gas flow prior to entering the liner.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Plasma apparatus and methods for processing feed material utilizing an upstream swirl module and composite gas flows |
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