Semiconductor package and manufacturing method thereof

A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring st...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, MENG-TSAN, CHIU, CHIENIA, TSAI, YU-LING, LIN, CHENG-HUNG, LAI, WEIIH, CHANG, HUNG-PIN, HSU, LI-HAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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