Polyamic acid composition, polyimide production method, laminate production method, and electronic device production method

This polyamic acid composition contains a polyamic acid and an organic solvent. The polyamic acid has a residue including a divalent organic group represented by chemical formula (1), a 3,3',4,4'-biphenyl tetracarboxylic dianhydride residue, and a p-phenylene diamine residue. The organic s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KATO, MOEKO, TAKI, RYUNOSUKE, SHIRAI, YUKI, TANAKA, NOBUAKI, NAKAYAMA, HIROFUMI, HORII, ETSUO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This polyamic acid composition contains a polyamic acid and an organic solvent. The polyamic acid has a residue including a divalent organic group represented by chemical formula (1), a 3,3',4,4'-biphenyl tetracarboxylic dianhydride residue, and a p-phenylene diamine residue. The organic solvent contains at least one compound selected from the group consisting of compounds represented by general formula (2) and compounds represented by general formula (3). In general formula (2), R1, R2, and R3 each independently represent a hydrogen atom or a monovalent organic group having one or more carbon atoms, and at least one of R1, R2, and R3 represents a monovalent organic group having two or more carbon atoms. In general formula (3), R4 represents a monovalent organic group having two or more carbon atoms.