System for routing connections to logic circuit and integrated circuit and method for manufacturing the same
Provided are a system for routing connections to a logic circuit, an integrated circuit and a method for manufacturing the same. The system including a first wafer having a backside and a frontside opposite the backside, a power conductor at the backside of the first wafer, a core at the frontside o...
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| creator | LEE, SEUNG-YOUNG SEO, KANGILL PARK, SAE-HAN |
| description | Provided are a system for routing connections to a logic circuit, an integrated circuit and a method for manufacturing the same. The system including a first wafer having a backside and a frontside opposite the backside, a power conductor at the backside of the first wafer, a core at the frontside of the first wafer, a power via electrically connected to the power conductor and to the core, a signal pad at the backside of the first wafer, a first frontside signal-routing metal at the frontside of the first wafer, and a signal via connected to the signal pad and the first frontside signal-routing metal. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | System for routing connections to logic circuit and integrated circuit and method for manufacturing the same |
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