Double-sided polishing apparatus

The present invention is to provide a double-sided polishing apparatus including a measuring hole and a thickness measuring sensor disposed in a range in which the measuring hole and the thickness measuring sensor pass through a set data acquisition range with higher frequency. A double-sided polish...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MARUTA, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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