Alkali-soluble resin, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

A photosensitive resin composition according to one embodiment of the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiation agent, and a sensitization agent, wherein the binder polymer includes an alkali-soluble resin having a structural unit d...

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Bibliographische Detailangaben
Hauptverfasser:	NAGOSHI, TOSHIMASA, TODA, NATSUKI, YUI, MOTOAKI, KINOSHITA, TAKEHIRO, SAWAKI, TAKU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A photosensitive resin composition according to one embodiment of the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiation agent, and a sensitization agent, wherein the binder polymer includes an alkali-soluble resin having a structural unit derived from acrylic acid, a structural unit derived from styrene or a styrene derivative, and a structural unit derived from a (meth)acrylate compound having an alicyclic structure.