Integrated chip and method for forming a trench capacitor

Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capaci...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHENG, HSIN-LI, TSUI, FELIX YING-KIT, SU, SHU-HUI, HSU, TINGN, LIN, JYUN-YING, WU, SHI-MIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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