Self-adaptive polishing pad and a curved surface polishing structure capable of improving processing efficiency and quality by using the magnetically conductive particles to maintain polishing stability and uniformity of the soft polishing pad

Self-adaptive polishing pad and a curved surface polishing structure capable of improving processing efficiency and quality by using the magnetically conductive particles to maintain polishing stability and uniformity of the soft polishing pad

The invention relates to a self-adaptive polishing pad and a curved surface polishing structure, including a soft polishing pad and a magnetic pole. The soft polishing pad includes a flexible body which is provided with a plurality of magnetically conductive particles and a plurality of fixed polish...

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1. Verfasser: CAI, FENG-ZHE
Format: Patent
Sprache:chi ; eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator CAI, FENG-ZHE
description The invention relates to a self-adaptive polishing pad and a curved surface polishing structure, including a soft polishing pad and a magnetic pole. The soft polishing pad includes a flexible body which is provided with a plurality of magnetically conductive particles and a plurality of fixed polishing particles. The magnetic pole can produce a magnetic attraction, and is disposed at a bottom of a work-piece. When the soft polishing pad performs a polishing process, the magnetically conductive particles can maintain polishing stability and uniformity of the soft polishing pad in response to changes of surfaces of the work-piece, so as to improve processing efficiency and quality.
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title Self-adaptive polishing pad and a curved surface polishing structure capable of improving processing efficiency and quality by using the magnetically conductive particles to maintain polishing stability and uniformity of the soft polishing pad
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