Semiconductor structure

Provided is a semiconductor structure including a first conductive layer, a second conductive layer and a first group of vias. The first conductive layer is disposed on a substrate. The second conductive layer is disposed on the first conductive layer. The first group of vias are disposed between the first conductive layer and the second conductive layer, and connect the first conductive layer and the second conductive layer. The first group of vias includes a first via, a second via, a third via and a fourth via. The first via and the second via are arranged in a first column. The third via and the fourth vias are arranged in a second column. The first via is adjacent to the third via, and the second via is adjacent to the fourth via. From the top view of the substrate, the extension direction of the first via is perpendicular to the extension direction of the second via, the extension direction of the third via is perpendicular to the extension direction of the fourth via, and the extending direction of the