Photosensitive resin composition

Photosensitive resin composition

Provided are: a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and that has excellent stability during storage; a patterned resin membrane using the photosensitive resin composition; and a method for producing a patterned polyimide resin membrane...

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1. Verfasser: EBISAWA, KAZUAKI
Format: Patent
Sprache:chi ; eng
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APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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creator EBISAWA, KAZUAKI
description Provided are: a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and that has excellent stability during storage; a patterned resin membrane using the photosensitive resin composition; and a method for producing a patterned polyimide resin membrane by using the photosensitive resin composition. This photosensitive resin composition comprises: a polyimide resin precursor (A) derived from a dicarboxylic acid compound that has an unsaturated group including a carbon-carbon double bond, and a diamine compound that has, in a side chain, an aromatic group and/or a diamine compound that has a 4,4'-dioxybiphenyl skeleton; a photo-radical polymerization initiator (C); and an organic solvent (S). A certain amount of a urea-based solvent (S1) is used as the organic solvent (S).
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language chi ; eng
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title Photosensitive resin composition
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