Photosensitive resin composition

Provided are: a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and that has excellent stability during storage; a patterned resin membrane using the photosensitive resin composition; and a method for producing a patterned polyimide resin membrane...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	EBISAWA, KAZUAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	Provided are: a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and that has excellent stability during storage; a patterned resin membrane using the photosensitive resin composition; and a method for producing a patterned polyimide resin membrane by using the photosensitive resin composition. This photosensitive resin composition comprises: a polyimide resin precursor (A) derived from a dicarboxylic acid compound that has an unsaturated group including a carbon-carbon double bond, and a diamine compound that has, in a side chain, an aromatic group and/or a diamine compound that has a 4,4'-dioxybiphenyl skeleton; a photo-radical polymerization initiator (C); and an organic solvent (S). A certain amount of a urea-based solvent (S1) is used as the organic solvent (S).