Photosensitive resin composition, patterned resin film, method for producing patterned resin film, and semiconductor circuit substrate

An embodiment of the present invention relates to a photosensitive resin composition, a patterned resin film, a method for producing a patterned resin film, and a semiconductor circuit substrate. The photosensitive resin composition comprises: a polymer (A) that is at least one selection from the gr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OGAWA, TAKU, ANDO, MITSUKA, KANNO, KIMIYUKI, ITO, HIROKAZU, NAKAFUJI, SHIN-YA, TATARA, RYOJI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An embodiment of the present invention relates to a photosensitive resin composition, a patterned resin film, a method for producing a patterned resin film, and a semiconductor circuit substrate. The photosensitive resin composition comprises: a polymer (A) that is at least one selection from the group consisting of polyimides and polyimide precursors, that contains a structural unit (a) containing a structural unit derived from an acid anhydride represented by formula (1) and contains a diamine-derived structural unit (b), and that has, e.g., a maleimide group, at a terminal on the polymer; (B) a photopolymerization initiator; and (D) a solvent. [In formula (1), L represents a single bond, etc.; R1 to R3 represents a hydrogen atom, etc., or represents an alkylene group formed by the bonding of the R1 and R2 (or R3) in the same ring with each other; n1 and n2 represent an integer from 0 to 3; and Y1 represents a structure given by (Y1)(-Ar1-), etc.].