Sensing device package structure
This invention provides a sensing device package structure which includes a plastic substrate, an outer wall, a sensing chip, an encapsulation layer, and a light-transmitting cover plate. The plastic substrate includes a setting surface and a circuit unit on the setting surface. The outer wall is di...
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| creator | CHEN, SHIHUN CHANG, CHUNIEH LEE, CHIA-LING TSENG, SHENG-TOU HUANG, ZUN-HUAN |
| description | This invention provides a sensing device package structure which includes a plastic substrate, an outer wall, a sensing chip, an encapsulation layer, and a light-transmitting cover plate. The plastic substrate includes a setting surface and a circuit unit on the setting surface. The outer wall is disposed on the setting surface and defined a setting space. The sensing chip includes a sensing surface and is arranged in the setting space and is electrically connected with the circuit unit. The encapsulation layer is arranged in the setting space and covers the sensing chip and exposes the sensing surface. The light-transmitting cover plate is spaced from the sensing surface, and includes an inner surface that facing the sensing surface. The distance from the center of the inner surface to the sensing surface is greater than the distance from the periphery of the inner surface to the sensing surface. Define the distance from a top surface of the outer wall to the setting surface as an outer wall height, and the |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Sensing device package structure |
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