Integrated circuit device

In an embodiment, an integrated circuit device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU, KUOIO, LEE, KUANGUN, LIN, WEN-YI, KUO, CHIEN-LI, LI, CHIENN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:In an embodiment, an integrated circuit device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant, the redistribution structure including a redistribution line, the redistribution line physically and electrically coupled to the die connector of the integrated circuit die, the redistribution line electrically isolated from the first through via, the redistribution line crossing over the first through via.