Substrate processing liquid, substrate processing method and substrate processing apparatus

The present invention provides a substrate processing liquid which is suitable for a substrate having a layer to be etched, wherein at least one of the bottom wall and the side wall of a trench structure is configured from a metal or a compound of the metal. This substrate processing liquid comprise...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HARUMOTO, AKIKO, HANAWA, YOSUKE, UEDA, DAI
Format: Patent
Sprache:chi ; eng
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