Method for manufacturing connection film
Provided is a highly productive method for producing a connection film. An adhesive is printed, in a predetermined shape, on a mold release film to form a connection film in the predetermined shape on the mold release film. Moreover, a plurality of connection films are formed in the predetermined sh...
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| creator | ASABA, KOSUKE SUGIOKA, SAORI |
| description | Provided is a highly productive method for producing a connection film. An adhesive is printed, in a predetermined shape, on a mold release film to form a connection film in the predetermined shape on the mold release film. Moreover, a plurality of connection films are formed in the predetermined shape in a width direction of the mold release film; the mold release film is cut longitudinally into pieces of a predetermined width; a plurality of mold release film pieces of the predetermined width are longitudinally connected together; and the connected mold release film pieces of the predetermined width are wound around a winding core. By this configuration, a high productivity can be achieved. |
| format | Patent |
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An adhesive is printed, in a predetermined shape, on a mold release film to form a connection film in the predetermined shape on the mold release film. Moreover, a plurality of connection films are formed in the predetermined shape in a width direction of the mold release film; the mold release film is cut longitudinally into pieces of a predetermined width; a plurality of mold release film pieces of the predetermined width are longitudinally connected together; and the connected mold release film pieces of the predetermined width are wound around a winding core. By this configuration, a high productivity can be achieved.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CURRENT COLLECTORS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231116&DB=EPODOC&CC=TW&NR=202344658A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231116&DB=EPODOC&CC=TW&NR=202344658A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ASABA, KOSUKE</creatorcontrib><creatorcontrib>SUGIOKA, SAORI</creatorcontrib><title>Method for manufacturing connection film</title><description>Provided is a highly productive method for producing a connection film. 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By this configuration, a high productivity can be achieved.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwTS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM7Py0tNLsnMz1NIy8zJ5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGxiYmZqYWjsbEqAEA7HUouw</recordid><startdate>20231116</startdate><enddate>20231116</enddate><creator>ASABA, KOSUKE</creator><creator>SUGIOKA, SAORI</creator><scope>EVB</scope></search><sort><creationdate>20231116</creationdate><title>Method for manufacturing connection film</title><author>ASABA, KOSUKE ; SUGIOKA, SAORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202344658A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ASABA, KOSUKE</creatorcontrib><creatorcontrib>SUGIOKA, SAORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ASABA, KOSUKE</au><au>SUGIOKA, SAORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing connection film</title><date>2023-11-16</date><risdate>2023</risdate><abstract>Provided is a highly productive method for producing a connection film. An adhesive is printed, in a predetermined shape, on a mold release film to form a connection film in the predetermined shape on the mold release film. Moreover, a plurality of connection films are formed in the predetermined shape in a width direction of the mold release film; the mold release film is cut longitudinally into pieces of a predetermined width; a plurality of mold release film pieces of the predetermined width are longitudinally connected together; and the connected mold release film pieces of the predetermined width are wound around a winding core. By this configuration, a high productivity can be achieved.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | Method for manufacturing connection film |
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