Packaging method and package structure
A packaging method is provided. Firstly, a plurality of chips are arranged on a carrying surface of a carrying board for chip redistribution. Each of the chips includes a first side connected to the carrying surface and a second side opposite to the first side, and the second side is formed with at...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A packaging method is provided. Firstly, a plurality of chips are arranged on a carrying surface of a carrying board for chip redistribution. Each of the chips includes a first side connected to the carrying surface and a second side opposite to the first side, and the second side is formed with at least one chip connecting member. Next, a base structure is provided and has a bonding surface with a plurality of predetermined areas for bonding the chips. Lastly, the base structure, the chips and the carrying board are combined together into a single construction by an encapsulating material under specific hot pressing conditions. |
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