Light sensing module and manufacturing method thereof

Light sensing module and manufacturing method thereof

A manufacturing method of a light sensing module includes: arranging an optical sensing element on a substrate; forming a first lens covering the optical sensing element by a compression molding process; remove a mold flash on a predetermined adhesive area on the substrate to form a groove, wherein...

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Hauptverfasser: HUNG, SHANG-MING, WU, KAO-PIN, HUANG, CHIEN-YU
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HUNG, SHANG-MING
WU, KAO-PIN
HUANG, CHIEN-YU
description A manufacturing method of a light sensing module includes: arranging an optical sensing element on a substrate; forming a first lens covering the optical sensing element by a compression molding process; remove a mold flash on a predetermined adhesive area on the substrate to form a groove, wherein the mold flash is produced by the compression molding process; injecting an adhesive into the groove; providing an package shell, wherein the package shell comprises a shell wall and a upper cover, the shell wall is connected to the upper cover and the upper cover has a first opening hole; adhering the package shell to the substrate, wherein the optical sensing element in a first space which is formed by the shell wall and the upper cover, the bottom surface of the shell wall is adhered to the bottom of the groove, the first opening of the upper cover is corresponding to the first lens and the optical sensing element.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light sensing module and manufacturing method thereof
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