Electroplating hole-filling method for printed circuit board
An electroplating hole- filling method for a printed circuit board, the method includes a circuit board preparation step, a dry film setting step, a pulse electroplating step, and a direct current electroplating step. The circuit board preparation step is to prepare a printed circuit board, wherein...
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| creator | LIN, PINUNG LIU, HUNGNG LAN, KUO-HSING |
| description | An electroplating hole- filling method for a printed circuit board, the method includes a circuit board preparation step, a dry film setting step, a pulse electroplating step, and a direct current electroplating step. The circuit board preparation step is to prepare a printed circuit board, wherein the printed circuit board includes a plurality of holes opened by laser drilling, and each hole has a concave-convex hole wall. The dry film setting step is to set the dry film on the printed circuit board, and the dry film has a plurality of openings corresponding to the holes. The pulse electroplating step is to perform pulse electroplating on the printed circuit board, and through pulse control, until a bump is formed on the concave-convex hole wall of each hole, wherein each bump protruding toward the center of the hole. The DC electroplating step is to perform DC electroplating on the printed circuit board to fill the holes. |
| format | Patent |
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The circuit board preparation step is to prepare a printed circuit board, wherein the printed circuit board includes a plurality of holes opened by laser drilling, and each hole has a concave-convex hole wall. The dry film setting step is to set the dry film on the printed circuit board, and the dry film has a plurality of openings corresponding to the holes. The pulse electroplating step is to perform pulse electroplating on the printed circuit board, and through pulse control, until a bump is formed on the concave-convex hole wall of each hole, wherein each bump protruding toward the center of the hole. The DC electroplating step is to perform DC electroplating on the printed circuit board to fill the holes.</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231001&DB=EPODOC&CC=TW&NR=202339561A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231001&DB=EPODOC&CC=TW&NR=202339561A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, PINUNG</creatorcontrib><creatorcontrib>LIU, HUNGNG</creatorcontrib><creatorcontrib>LAN, KUO-HSING</creatorcontrib><title>Electroplating hole-filling method for printed circuit board</title><description>An electroplating hole- filling method for a printed circuit board, the method includes a circuit board preparation step, a dry film setting step, a pulse electroplating step, and a direct current electroplating step. The circuit board preparation step is to prepare a printed circuit board, wherein the printed circuit board includes a plurality of holes opened by laser drilling, and each hole has a concave-convex hole wall. The dry film setting step is to set the dry film on the printed circuit board, and the dry film has a plurality of openings corresponding to the holes. The pulse electroplating step is to perform pulse electroplating on the printed circuit board, and through pulse control, until a bump is formed on the concave-convex hole wall of each hole, wherein each bump protruding toward the center of the hole. 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The circuit board preparation step is to prepare a printed circuit board, wherein the printed circuit board includes a plurality of holes opened by laser drilling, and each hole has a concave-convex hole wall. The dry film setting step is to set the dry film on the printed circuit board, and the dry film has a plurality of openings corresponding to the holes. The pulse electroplating step is to perform pulse electroplating on the printed circuit board, and through pulse control, until a bump is formed on the concave-convex hole wall of each hole, wherein each bump protruding toward the center of the hole. The DC electroplating step is to perform DC electroplating on the printed circuit board to fill the holes.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Electroplating hole-filling method for printed circuit board |
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