Package comprising an acoustic device and a cap substrate comprising an inductor

Package comprising an acoustic device and a cap substrate comprising an inductor

A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrat...

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Hauptverfasser: HOFER, MANUEL, HATZL, STEFAN LEOPOLD, WIESBAUER, KURT, RAK, FLORIAN, FAULHABER, HORST UWE, KRAVCHENKO, ROMAN, HAGN, PETER, BRUNNER, SEBASTIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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creator HOFER, MANUEL
HATZL, STEFAN LEOPOLD
WIESBAUER, KURT
RAK, FLORIAN
FAULHABER, HORST UWE
KRAVCHENKO, ROMAN
HAGN, PETER
BRUNNER, SEBASTIAN
description A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrate is configured as a cap for the acoustic device. The package includes a cavity located between the acoustic device and the cap substrate. The frame may include a polymer frame.
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language chi ; eng
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subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title Package comprising an acoustic device and a cap substrate comprising an inductor
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