Vacuum processing system for depositing a material onto a thin film substrate, apparatus and method for transporting a thin film substrate under vacuum conditions
An apparatus (10) for transportation of a thin film substrate (12) under vacuum conditions is described. The apparatus (10) for transportation includes a rotatable roller (100) with a substrate facing surface (102) including a first substrate facing surface portion (104), wherein the substrate facin...
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creator | SCHNAPPENBERGER, FRANK |
description | An apparatus (10) for transportation of a thin film substrate (12) under vacuum conditions is described. The apparatus (10) for transportation includes a rotatable roller (100) with a substrate facing surface (102) including a first substrate facing surface portion (104), wherein the substrate facing surface (102) includes one or more gas outlets (105), wherein the one or more gas outlets are configured for releasing a gas flow and the roller includes a deposition region (106) and at least one non-deposition region (108). The apparatus further includes a gas distribution system (400) for providing the gas flow through the one or more gas outlets (105) into an interspace between the thin film substrate (12) and the first substrate facing surface portion (104), and a sealing belt conveyor system (120) including one or more sealing belts (122) provided at the at least one non-deposition region (108). |
format | Patent |
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The apparatus (10) for transportation includes a rotatable roller (100) with a substrate facing surface (102) including a first substrate facing surface portion (104), wherein the substrate facing surface (102) includes one or more gas outlets (105), wherein the one or more gas outlets are configured for releasing a gas flow and the roller includes a deposition region (106) and at least one non-deposition region (108). The apparatus further includes a gas distribution system (400) for providing the gas flow through the one or more gas outlets (105) into an interspace between the thin film substrate (12) and the first substrate facing surface portion (104), and a sealing belt conveyor system (120) including one or more sealing belts (122) provided at the at least one non-deposition region (108).</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230901&DB=EPODOC&CC=TW&NR=202334472A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230901&DB=EPODOC&CC=TW&NR=202334472A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHNAPPENBERGER, FRANK</creatorcontrib><title>Vacuum processing system for depositing a material onto a thin film substrate, apparatus and method for transporting a thin film substrate under vacuum conditions</title><description>An apparatus (10) for transportation of a thin film substrate (12) under vacuum conditions is described. The apparatus (10) for transportation includes a rotatable roller (100) with a substrate facing surface (102) including a first substrate facing surface portion (104), wherein the substrate facing surface (102) includes one or more gas outlets (105), wherein the one or more gas outlets are configured for releasing a gas flow and the roller includes a deposition region (106) and at least one non-deposition region (108). The apparatus further includes a gas distribution system (400) for providing the gas flow through the one or more gas outlets (105) into an interspace between the thin film substrate (12) and the first substrate facing surface portion (104), and a sealing belt conveyor system (120) including one or more sealing belts (122) provided at the at least one non-deposition region (108).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNTrsOwjAM7MKAgH8wO0ioRWJGCMQHVDBWpnFppMaO4gSJ3-FLCY-Rgel8d_b5xsXjhG1KDnyQllQtX0HvGslBJwEMeVEbXyqCw0jB4gDCUTKPvWXo7OBA00VjyPYC0HvMU1JANuAo9mLeUdln9RK-YT-OIbGhALdPoVbY5M_COi1GHQ5Ksy9OivlhX--Oy1yuIfXYElNs6nO5Kqtqvd6U2-qfnSeDd1cR</recordid><startdate>20230901</startdate><enddate>20230901</enddate><creator>SCHNAPPENBERGER, FRANK</creator><scope>EVB</scope></search><sort><creationdate>20230901</creationdate><title>Vacuum processing system for depositing a material onto a thin film substrate, apparatus and method for transporting a thin film substrate under vacuum conditions</title><author>SCHNAPPENBERGER, FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202334472A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHNAPPENBERGER, FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHNAPPENBERGER, FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Vacuum processing system for depositing a material onto a thin film substrate, apparatus and method for transporting a thin film substrate under vacuum conditions</title><date>2023-09-01</date><risdate>2023</risdate><abstract>An apparatus (10) for transportation of a thin film substrate (12) under vacuum conditions is described. The apparatus (10) for transportation includes a rotatable roller (100) with a substrate facing surface (102) including a first substrate facing surface portion (104), wherein the substrate facing surface (102) includes one or more gas outlets (105), wherein the one or more gas outlets are configured for releasing a gas flow and the roller includes a deposition region (106) and at least one non-deposition region (108). The apparatus further includes a gas distribution system (400) for providing the gas flow through the one or more gas outlets (105) into an interspace between the thin film substrate (12) and the first substrate facing surface portion (104), and a sealing belt conveyor system (120) including one or more sealing belts (122) provided at the at least one non-deposition region (108).</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Vacuum processing system for depositing a material onto a thin film substrate, apparatus and method for transporting a thin film substrate under vacuum conditions |
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