Resin composition for flexible device, film-like adhesive for flexible device, adhesive sheet for flexible device, and method for manufacturing flexible device

Provided is a resin composition for a flexible device, the resin composition containing an epoxy resin and a phenoxy resin. The glass transition temperature of the cured product of the resin composition is 60 DEG C or higher and the storage modulus of the cured product is 5.0 GPa or lower. Also prov...

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Bibliographische Detailangaben
1. Verfasser:	SAKAI, KOYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ADVERTISING CHEMISTRY CRYPTOGRAPHY DISPLAY DISPLAYING DYES EDUCATION LABELS OR NAME-PLATES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES SEALS SIGNS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is a resin composition for a flexible device, the resin composition containing an epoxy resin and a phenoxy resin. The glass transition temperature of the cured product of the resin composition is 60 DEG C or higher and the storage modulus of the cured product is 5.0 GPa or lower. Also provided: are a film-like adhesive using the resin composition for a flexible device; an adhesive sheet having a layered structure of the film-like adhesive composition and a flexible substrate; and a method for manufacturing a flexible device.