Auto-calibration to a station of a process module that spins a wafer

A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotat...

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Hauptverfasser: HIESTER, JACOB L, KONKOLA, PAUL, BLANK, RICHARD, THAULAD, PETER
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creator HIESTER, JACOB L
KONKOLA, PAUL
BLANK, RICHARD
THAULAD, PETER
description A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Auto-calibration to a station of a process module that spins a wafer
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