Substrate processing method and substrate processing system
An object of the invention is to suppress grinding damage to a substrate after grinding both sides of the substrate. A substrate processing method for processing a substrate, the method including grinding a first surface of a substrate, and then, after grinding the first surface, grinding a second s...
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| creator | IKEUE, KAZUYA KANEKO, TOMOHIRO HAYAKAWA, SUSUMU |
| description | An object of the invention is to suppress grinding damage to a substrate after grinding both sides of the substrate. A substrate processing method for processing a substrate, the method including grinding a first surface of a substrate, and then, after grinding the first surface, grinding a second surface of the substrate on the opposite side from the first surface, wherein when grinding the first surface, first grinding marks are formed which extend in a curved manner from the central section of the first surface toward the outer peripheral section, when grinding the second surface, second grinding marks are formed which extend in a curved manner from the central section of the second surface toward the outer peripheral section, and the curvature direction of the first grinding marks and the curvature direction of the second grinding marks are opposite when viewed in a transparent view from one of the surfaces. |
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A substrate processing method for processing a substrate, the method including grinding a first surface of a substrate, and then, after grinding the first surface, grinding a second surface of the substrate on the opposite side from the first surface, wherein when grinding the first surface, first grinding marks are formed which extend in a curved manner from the central section of the first surface toward the outer peripheral section, when grinding the second surface, second grinding marks are formed which extend in a curved manner from the central section of the second surface toward the outer peripheral section, and the curvature direction of the first grinding marks and the curvature direction of the second grinding marks are opposite when viewed in a transparent view from one of the surfaces.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230801&DB=EPODOC&CC=TW&NR=202331828A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230801&DB=EPODOC&CC=TW&NR=202331828A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IKEUE, KAZUYA</creatorcontrib><creatorcontrib>KANEKO, TOMOHIRO</creatorcontrib><creatorcontrib>HAYAKAWA, SUSUMU</creatorcontrib><title>Substrate processing method and substrate processing system</title><description>An object of the invention is to suppress grinding damage to a substrate after grinding both sides of the substrate. 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A substrate processing method for processing a substrate, the method including grinding a first surface of a substrate, and then, after grinding the first surface, grinding a second surface of the substrate on the opposite side from the first surface, wherein when grinding the first surface, first grinding marks are formed which extend in a curved manner from the central section of the first surface toward the outer peripheral section, when grinding the second surface, second grinding marks are formed which extend in a curved manner from the central section of the second surface toward the outer peripheral section, and the curvature direction of the first grinding marks and the curvature direction of the second grinding marks are opposite when viewed in a transparent view from one of the surfaces.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Substrate processing method and substrate processing system |
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